CA-LAP-300 Automatic Precision Polishing System

The CA-LAP-300 is a programmable machine that enables precise semi-automatic and automatic sample preparation of a wide range of materials for microscopic (optical subtract, semiconductor wafer, Fiber Optical, TEM, AFM, etc.) evaluation.

Capabilities include parallel polishing, angle polishing,
site-specific polishing or any combination thereof.
It provides reproducible results by eliminating inconsistencies between users, regardless of their skill.

Sub-micro accuracy micrometers control (pitch and roll) precision polishing Jig allow precise sample tilt adjustments relative to the abrasive plane. A rigid
Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/ polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Download Datasheet (PDF)

Features

Grinder/Polisher Features:

Variable platen speed: 5-500 RPM (5 RPM increments)
7" color LCD touchscreen with keypad entry to control all functions
Intuitive interface optimized for productivity and function
Seamless integration with optional Fluid Dispenser for fully automatic operation
Stable RIM, aluminum and stainless steel construction
Timer for count-up or countdown operation
Clockwise/counterclockwise platen rotation
Electronic coolant control with adjustable valve
Retractable coolant nozzle to allow quick and easy sample/bowl cleaning
Overflow diversion protects internal components
Emergency shut-off switch
Two (2) year warranty
Designed and manufactured in the USA

Precision Polishing Jig Features:

Front digital indicator to display real-time material removal (sample advancement) with zeroing function, 1 µm resolution
Precision spindle that indexes the sample perpendicular to the platen and can rotate simultaneously
Dual axis, micrometer controlled angular positioning of the sample (pitch and roll): +10° / -2.5° range (0.02° increments)
Rear digital indicator to display vertical positioning (static) with zeroing function, 1 µm resolution
Automatic sample oscillation, adjustable sweep with 4 speeds
Full or limited automatic sample rotation with 4 speeds
Cam-locking system that eliminates the need for tools and allows for precise repositioning of fixtures
Variable sample load: 0-600 g (100 g increments)

Specification

Items	Description
Model #	CA-LAP-300
Arm Swept Frequancy	9 times/Min
Loading Weight	500 g（Customer Selectable）
Drive Motor Power	1 kW
Clean Water On/off Control	Enable
Polishing Plate(mm)	φ300
Speed（r/min）	5-500
Rotation Direction	Anti Clock/Clock Select-able
Manual Control	V1=10、V2=50、V3=100、V4=500 （r/min）（Customer Selectable）
Auto-Polishing Parameters Setting	Max. 64 Sets (Includes：Speed、Time and rotation direction)
Polishing Parameters Setting	Customer Setting and Recall Programmable
Power	AC：100 - 240V，Frequency：50-60 Hz
Dimension	760 x 430 x 360（LWH）mm
Weight	30kg

Contact Information

United States:

WESTERN OPTRONICS INC.

3652 Edison Way

Fremont, CA 94536

USA

Tel: +1 510-366-7353

Fax: 1-510-795-1795

www.westernoptronics.com

Product specifications and descriptions in this documentation subject to change without notice.

May, 2020

31000087 V1.40

Description

Overview

The CA-LAP-300 is a programmable precision polishing system for preparing material samples before microscopic evaluation. It supports parallel polishing, angle polishing and site-specific polishing, including combinations of these methods. The polishing jig provides pitch and roll adjustment, while a Z-indexing spindle maintains the selected geometric orientation. Digital indicators allow material removal and vertical positioning to be monitored. Adjustable loading, sample rotation and oscillation provide configuration choices for the preparation process. Consult the specification and feature tabs when defining the required sample preparation sequence.

Programmable semi-automatic and automatic sample preparation.
Parallel, angle and site-specific polishing capabilities.
Digital indicators for material removal and positioning.
Adjustable loading with sample rotation and oscillation.

For subsequent optical measurement tasks, explore the CA-MS non-contact XYZ measuring microscopes.