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Arabic Wafer Processing & Inspection
Equipment for wafer and materials sample preparation, optical inspection and measurement. Browse precision polishing systems, non-contact measuring microscopes and wafer inspection systems.
CA-LAP-300 Automatic Precision Polishing System
The CA-LAP-300 is a programmable machine that enables precise semi-automatic and automatic sample preparation of a wide range of materials for microscopic (optical subtract, semiconductor wafer, Fiber Optical, TEM, AFM, etc.) evaluation.
Capabilities include parallel polishing, angle polishing,
site-specific polishing or any combination thereof.
It provides reproducible results by eliminating inconsistencies between users, regardless of their skill.
Sub-micro accuracy micrometers control (pitch and roll) precision polishing Jig allow precise sample tilt adjustments relative to the abrasive plane. A rigid
Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/ polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.
CA-MS Series Non-Contact XYZ Measuring Microscopes
This microscope system offers a precise focus indicator consisting of an index graticule (Target Mark) and a beam-splitting prism built into the reflecting illumination optical system of the microscope. And it has been designed based on the optical principle that at just focus status, of which the upper and lower halves coincide, can be observed above the focused image of a specimen, and that when defocused even slightly, the index line is split into two lines in the upper and lower halves of the graticule.
CA-DMS1000 Digital Microscope with Extended Depth of Field
The CA-DMS1000 is a digital microscope with extended depth of field for observing samples with uneven surfaces. Its documented image-processing functions include depth-of-field fusion, image stitching and 2D/3D measurement. The system supports inspection of semiconductor, electronic, metal and other industrial samples.