ਸ਼ੁੱਧਤਾ ਨਵਰੂਪਨ ਸਿਸਟਮ

The CA-LAP-300 is a programmable machine that enables precise semi-automatic and automatic sample preparation of a wide range of materials for microscopic (optical subtract, semiconductor wafer, Fiber Optical, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. Sub-micro accuracy micrometers control (pitch and roll) precision polishing Jig allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/ polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

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