CA-LAP-300 automatic precision lapping and polishing system
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CA-MS series non-contact XYZ measuring microscope
CA-MS 系列非接触 XYZ 测量显微镜

CA-LAP-300 自动精密抛光系统 | 西岸光电

The CA-LAP-300 is a programmable machine that enables precise semi-automatic and automatic sample preparation of a wide range of materials for microscopic (optical subtract, semiconductor wafer, Fiber Optical, TEM, AFM, etc.) evaluation.

Capabilities include parallel polishing, angle polishing,
site-specific polishing or any combination thereof.
It provides reproducible results by eliminating inconsistencies between users, regardless of their skill.

Sub-micro accuracy micrometers control (pitch and roll) precision polishing Jig allow precise sample tilt adjustments relative to the abrasive plane. A rigid
Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/ polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Download Datasheet (PDF)

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Features

Features

Grinder/Polisher Features:

  • Variable platen speed: 5-500 RPM (5 RPM increments)
  • 7" color LCD touchscreen with keypad entry to control all functions
  • Intuitive interface optimized for productivity and function
  • Seamless integration with optional Fluid Dispenser for fully automatic operation
  • Stable RIM, aluminum and stainless steel construction
  • Timer for count-up or countdown operation
  • Clockwise/counterclockwise platen rotation
  • Electronic coolant control with adjustable valve
  • Retractable coolant nozzle to allow quick and easy sample/bowl cleaning
  • Overflow diversion protects internal components
  • Emergency shut-off switch
  • Two (2) year warranty
  • Designed and manufactured in the USA

 

Precision Polishing Jig Features:

  • Front digital indicator to display real-time material removal (sample advancement) with zeroing function, 1 µm resolution
  • Precision spindle that indexes the sample perpendicular to the platen and can rotate simultaneously
  • Dual axis, micrometer controlled angular positioning of the sample (pitch and roll): +10° / -2.5° range (0.02° increments)
  • Rear digital indicator to display vertical positioning (static) with zeroing function, 1 µm resolution
  • Automatic sample oscillation, adjustable sweep with 4 speeds
  • Full or limited automatic sample rotation with 4 speeds
  • Cam-locking system that eliminates the need for tools and allows for precise repositioning of fixtures
  • Variable sample load: 0-600 g (100 g increments)
Specification

Specification

      Items

Description

Model #

CA-LAP-300

Arm Swept Frequancy

9 times/Min

Loading Weight

500 g（Customer Selectable）

Drive Motor Power

1 kW

Clean Water On/off Control

Enable

Polishing Plate(mm)

φ300

Speed（r/min）

5-500

Rotation Direction

Anti Clock/Clock Select-able

Manual Control

V1=10、V2=50、V3=100、V4=500 （r/min）（Customer Selectable）

Auto-Polishing Parameters Setting

Max. 64 Sets (Includes：Speed、Time and rotation direction)

Polishing Parameters Setting

Customer Setting and Recall Programmable

Power

AC：100 - 240V，Frequency：50-60 Hz

Dimension

760 x 430 x 360（L*W*H）mm

Weight

30kg

Contact Information

Contact Information

United States:

WESTERN OPTRONICS INC.

3652 Edison Way

Fremont, CA  94536

USA

Tel: +1 510-366-7353

Fax: 1-510-795-1795

www.westernoptronics.com

Product specifications and descriptions in this documentation subject to change without notice.

Copyright @ 2008 WESTERN OPTRONICS INC.

May, 2020

31000087  V1.40

描述

Overview

The CA-LAP-300 is a programmable precision polishing system for preparing material samples before microscopic evaluation. It supports parallel polishing, angle polishing and site-specific polishing, including combinations of these methods. The polishing jig provides pitch and roll adjustment, while a Z-indexing spindle maintains the selected geometric orientation. Digital indicators allow material removal and vertical positioning to be monitored. Adjustable loading, sample rotation and oscillation provide configuration choices for the preparation process. Consult the specification and feature tabs when defining the required sample preparation sequence.

  • Programmable semi-automatic and automatic sample preparation.
  • Parallel, angle and site-specific polishing capabilities.
  • Digital indicators for material removal and positioning.
  • Adjustable loading with sample rotation and oscillation.

For subsequent optical measurement tasks, explore the CA-MS non-contact XYZ measuring microscopes.